LONDON: Two major next generation smartphones, Samsung Galaxy S5 and Apple iPhone 6 will reportedly be equipped with liquid cooling technology, which is already being used in some laptops.
According to a report, both Samsung Electronics (NASDAQ:SSNLF) and Apple Inc. (NASDAQ:AAPL) are evaluating the use of liquid cooling technology for their next generation of smartphones.
“Smartphone players such as Apple, Samsung Electronics and High Tech Computer have started showing interest in adopting ultra-thin heat pipes for their smartphones and are expected to release heat pipe-adopted models in the fourth quarter, at the earliest, according to sources from cooling module player,” DigiTimes reported. “Heat pipe cooled smartphone models could be released by the fourth quarter at the earliest,” the report added.
In the liquid cooling technology, ultra-thin heat pipes are used to carry heat away from processors and wireless chip. Heat pipes contain a liquid that turns into a vapour when it comes into contact with a hot interface. The vapour then travels along the heat pipe to the cold interface, condensing back into a liquid, and releasing the latent heat.
Traditionally, smartphones such as the iPhone have used a graphite-plus-foil insulating method to keep the heat within the device, but with apps getting more and more demanding of processors, and processors getting more powerful, this method is no longer efficient enough to keep the heat from filtering out, as we all know very well.